United States
The Non-degree in Semiconductor Packaging Manufacturing at Arizona State University is a program for international students taught in English.
This course will provide information on the various stages of semiconductor package manufacturing, including sort, assembly, and final test. In addition, we will also describe how to select, build, and test the packages with the die and other components to ensure the quality of the package and total assembly performance. We will also discuss the role of Process Control Systems in semiconductor manufacturing as they relate to quality testing. Specifically, we will explore how Process Control Systems can help identify and correct process problems that cause variation and quality issues. Finally, we also demonstrate how to use control charts to monitor the process performance. These can assist in decision-making, specifically when to take action to improve the process.
Application Fee
$0 USD
$0 USD
Tuition Fee
$49 USD
$49 USD
per year
All students from all countries are eligible to apply to this program.
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Application Fee
$0 USD
Service Fee
$0 USD
Tuition
49
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