Master in Program on Semiconductor Manufacturing Technology

Tuition fees are 112,500 TWD per year; applications for the Jul 2027 intake are open until Sep 15, 2027.

The Program on Semiconductor Manufacturing Technology at National Cheng Kung University, located in Southern Taiwan, offers master's-level training in the processes used to fabricate microchips. Semiconductor manufacturing is the branch of engineering concerned with turning raw silicon wafers into functioning integrated circuits through a sequence of precise steps including photolithography, etching, thin-film deposition, doping, and packaging. Students studying this field typically cover semiconductor device physics, process engineering, cleanroom techniques, yield analysis, and the equipment and quality-control methods used in wafer fabrication facilities. Because manufacturing processes must be executed with extremely tight tolerances to produce functional chips at scale, coursework also tends to address statistical process control and troubleshooting of production issues. Southern Taiwan is home to a substantial concentration of semiconductor fabrication activity, giving students in this program exposure to a region where the manufacturing side of the chip industry is a major economic presence. Graduates of master's programs in semiconductor manufacturing technology commonly move into process engineering, equipment engineering, and yield engineering roles at wafer fabrication plants, as well as into quality assurance and manufacturing management positions within the broader electronics supply chain. The program combines technical coursework with a research or applied project component, preparing graduates for immediate entry into the semiconductor manufacturing workforce or for further doctoral study in the field. Because instruction is offered in English, the program is structured to be accessible to international students alongside domestic ones, which reflects how global the workforce and supply chains of semiconductor manufacturing tend to be. Candidates typically enter with a background in electrical engineering, materials science, physics, or a closely related discipline.