PhD in Program on Semiconductor Packaging and Testing

Tuition is 108,540 TWD per year; the deadline to apply for the Jul 2027 intake is Sep 15, 2027.

A doctoral track within National Cheng Kung University's Program on Semiconductor Packaging and Testing, based in Southern Taiwan, trains researchers to study the engineering challenges involved in enclosing, connecting, and verifying integrated circuits. Packaging and testing as a discipline addresses how a finished silicon chip is protected, electrically connected to the rest of a device, cooled, and confirmed to meet reliability standards, drawing on mechanical, electrical, and materials engineering. Doctoral study in this area generally combines advanced coursework in packaging materials, thermal management, and test methodology with independent research into problems such as improving reliability, developing new packaging architectures for multi-chip assemblies, or advancing testing techniques for increasingly complex devices. Southern Taiwan's concentration of semiconductor packaging and testing facilities places doctoral researchers near an industry segment that depends on ongoing innovation to keep pace with denser and more complex chip designs. Careers available to graduates of doctoral programs in this field include research and development roles within semiconductor companies, positions at firms specializing in advanced packaging, work at materials and equipment suppliers, and academic or research institute careers. The doctoral track emphasizes original research, typically resulting in a dissertation addressing a specific packaging or testing problem, supported by advanced coursework and faculty supervision. Because instruction is delivered in English, the program is designed to be accessible to doctoral candidates from outside Taiwan as well as domestic researchers, in keeping with how internationally connected the semiconductor packaging research community is. Entrants generally hold a strong background in electrical engineering, mechanical engineering, or materials science from prior study.